Join Indium Corporation’s Ron Lasky, Ph.D., PE, senior technologist, as he hosts a webinar on intermetallics and their importance to solder joints on Tuesday, Sept. 21, 1 p.m. New York as part of the company’s free webinar program, the InSIDER Series.

In this webinar, Dr. Lasky will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance. The brittle nature of copper-tin intermetallics will also be discussed. In addition, several graphs of intermetallic growth rate will be presented. Some of the additional ancillary effects of copper-tin intermetallic growth—such as tin whiskers and their mitigation—will also be discussed.